Infineon Technologies and SOLUM have signed a memorandum of understanding to deepen work on high-voltage direct current power gear for AI data centres, the companies said on 5 November 2026. Infineon’s Munich–Seoul release and SOLUM’s matching statement frame the deal as an expansion of existing technical cooperation across intermediate bus converters, battery backup units and power supply units — not as a finished product launch or a contracted megawatt deployment.
SOLUM used a collaboration tech day at its SolSquare campus in Yongin to show rack-level hardware that already leans on Infineon silicon. That showcase is the source of the concrete module numbers in this story; the MoU itself is the commercial wrapper.
A 26 kW BBU is not the 33 kW shelf
Among the units SOLUM presented was a 26 kW-class battery backup unit DC/DC converter for 800 Vdc rack architectures, built around Infineon CoolSiC MOSFETs, EiceDRIVER gate drivers and PSOC digital power controllers. SOLUM says the module is being developed toward a peak efficiency above 98.5%, with mass production targeted for 2027. Those efficiency and date figures are prospective targets for that BBU path, not a guarantee that every shipped unit will hit the number on day one.
Separately, SOLUM showed an LVDC BBU DC/DC converter, an ORv3-compatible 33 kW power shelf and server PSUs. The 33 kW shelf is a different box from the 26 kW 800 Vdc BBU: one is an Open Rack v3-compatible power shelf; the other is a high-voltage backup converter for 800 Vdc racks. Mixing the two ratings into a single “33-plus-26 kW MoU product” would invent a catalogue SKU neither company announced.
Adam White, Infineon’s Power Systems division president, said AI data centres need “power infrastructure with increasing levels of efficiency, reliability and power density,” and pointed to Korea as a strong AI hardware market where SOLUM’s server-power design complements Infineon’s semiconductors.
How this sits next to other TSN power-for-AI posts
Infineon’s SiC supply story already sits on TSN in the Wolfspeed 200 mm wafer extension. On the facility side, Vantage’s Heron solid-state transformer bookings above 1 GW show operators committing capital to 800 Vdc-class conversion plant. The closest process cousin is another early-stage pact: Mitsubishi Heavy Industries and Ingeteam’s US MoU on AI data-centre power. Infineon–SOLUM belongs with those MoU and 800 Vdc threads, not with a completed campus energisation.
MoUs buy design time, not rack megawatts
For operators planning HVDC data centre halls, the useful read is collaboration depth rather than nameplate capacity. Infineon says it will join SOLUM from early project stages with reference designs and technical support across Si, SiC and GaN portfolios. That language describes a design partnership. It stops short of disclosing how many 26 kW BBUs any hyperscaler has ordered, or when a named European or UK hall will take 800 Vdc feed from this stack.
Keeping the BBU and the ORv3 shelf in separate mental buckets matters for bill-of-materials readers. Backup conversion for an 800 Vdc rack is a continuity function; a 33 kW ORv3-compatible shelf is a power-delivery block with a different mechanical and electrical envelope. Treating the MoU as if it shipped both as one certified SKU would over-read a collaboration day.
UK and EU readers should treat Korea’s showcase as the first public hardware snapshot and Munich as the semiconductor anchor. Availability of the 26 kW BBU outside SOLUM’s 2027 production target is not spelled out as a UK SKU in these releases. The transferable point is architectural: AI racks are pulling vendors toward higher DC bus voltages and denser backup converters, and MoUs are how semiconductor and PSU houses lock that roadmap before volume.
What to watch next
Three public breadcrumbs would harden the file: SOLUM stating a firm production start month for the 26 kW 800 Vdc BBU; a named data-centre customer reference that separates BBU shipments from shelf shipments; or Infineon publishing a joint reference design that restates the >98.5% target with test conditions. Until then, the dual primary record is an HVDC data centre MoU plus a showcased 26 kW-class 800 Vdc BBU on a 2027 production aim — prospective efficiency, not a completed deployment.
Sources
Primary:
- Infineon: MoU with SOLUM on HVDC for AI data centres (5 Nov 2026)
- SOLUM: MoU with Infineon / 26 kW-class 800 Vdc BBU showcase (5 Nov 2026)
Related stories
- Infineon and Wolfspeed Extend SiC Wafer Supply Deal to 200 mm
- Vantage Books Over 1GW of Heron Solid-State Transformers for AI Sites
- Mitsubishi Heavy Industries and Ingeteam Sign a US MoU on Power for AI Data Centres
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