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TSMC Adds Another 3nm Fab in Tainan, With Volume Output in 1H 2028

TSMC will add a further 3nm fab in Tainan, with volume production in the first half of 2028, making three new 3nm fabs in Taiwan, Arizona and Japan.

TSMC Q3 Revenue Rises 50.9% to NT$1.49tn, Guides Q4 to US$52.3-54.3bn

TSMC's third-quarter revenue rose 50.9% to NT$1,494.24bn. It guided Q4 to US$52.3-54.3bn and now expects about 44% revenue growth for 2026.

ByteDance Is in Advanced Talks to Buy Custom MediaTek Chips for Its Data Centres, Bloomberg Reports

ByteDance is close to a deal to buy custom MediaTek chips for its data centres, Bloomberg reports, citing people familiar. Neither company has confirmed.

Jury Finds Arm Breached Its License With Qualcomm, but Awards Qualcomm Just $2

A Delaware jury found Arm breached its license with Qualcomm but awarded only $2 in nominal damages. Both companies are claiming victory.

Astera Labs Unveils Orion, a Rack Design for AI Inference That Works With Any Make of Chip

Astera Labs' Orion is a rack reference design for AI inference that works with any GPU or CPU and scales to 160 per pod. Partners sell it from Q1 2027.

AMD Launches Its Next Ryzen AI Halo Developer Platform, With Up to 192GB of Memory for Running Large AI Models Locally

AMD has launched its next Ryzen AI Halo developer platform, with the Ryzen AI Max+ PRO 495 and up to 192GB of memory for running big AI models locally.

Chinese Firms Bought 1mn+ Nvidia Gaming and Workstation Chips, FT Says

Chinese tech firms bought over 1mn Nvidia gaming and workstation chips this year, the FT reported, citing industry insiders. Nvidia has not confirmed it.

IBM Moves Its Spyre AI Chip’s Compiler Onto PyTorch’s Open-Source Inductor

IBM's Spyre accelerator now compiles through PyTorch's open-source Inductor. IBM says the new compiler code is about 7x smaller than the one it replaced.

Intel Names Crescent Island the Intel GPU D-Series; First Card Is the D270

Intel names its Crescent Island inference GPU the Intel GPU D-series. The first card, the D270, is an air-cooled PCIe card with up to 480GB of memory.

AMD Introduces Helion, an Open Rack Design for Agentic AI With Up to 32,768 CPU Cores

AMD unveils Helion, an open OCP-based rack blueprint for agentic AI with up to 32,768 EPYC CPU cores. AMD says it is planned for November 2026.

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