investment - Page 13
Stories from investment come first, newest first, then stories from connected topics (Terafab, Semiconductors, AI Chips & Compute, Blockchain, Crypto News, Bitcoin), each labelled with where it comes from. This view is not indexed by search engines.
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DTCC Tokenization Service Is Live: What It Covers at Launch
DTCC’s one-pager: 25 securities and ~$30T available to tokenize at launch on Canton and Besu. Roadmap indicative; subject to SEC no-action; not yet live.
Kevin Boon Becomes Mysten Labs CEO as Evan Cheng Leads New AI Unit
Mysten Labs President Kevin Boon becomes CEO; Evan Cheng stays CTO and will lead a new AI business unit for agentic trust. No effective date given.
Swedish Firms Launch Sferical One Shared AI Supercomputer
AstraZeneca, Ericsson, Saab, SEB and Wallenberg Investments launched Sferical One, an NVIDIA DGX SuperPOD of 16 GB300 systems, running since late summer.
MSCI Will Apply Non-Operating-Company Screens to Global Indexes From 30 November 2026
MSCI will bar some non-operating companies from its global indexes from 30 Nov 2026. It names no firms; Strategy and Metaplanet risk is reported by others.
Infineon and Wolfspeed Extend SiC Wafer Supply Deal to 200 mm
Infineon and Wolfspeed moved their SiC wafer supply deal to 200 mm. No value or volumes disclosed; Yole market figure is via Wolfspeed.
Strive Buys 6,182 Bitcoin and Sets Up a $1bn SATS Sales Plan
Strive bought 6,182 bitcoin from 17 to 23 Oct, taking holdings to 43,000 BTC, and may sell up to $1bn more SATS preferred stock through sales agents.
Taiwan Plans a Texas Industrial Park for TSMC and Foxconn Suppliers
Taiwan plans a Texas park for TSMC and Foxconn suppliers, up to $4bn to start, Kung told Bloomberg. MOEA: firms fund it; land not confirmed.
DuckDB Posts Unaudited TPC-H SF1,000 Results for v2.0-dev on a Single NVIDIA Vera Socket
DuckDB published unaudited TPC-H SF1,000 results for a v2.0-dev preview on one NVIDIA Vera socket. Figures are DuckDB’s own, with NVIDIA’s help.
SK hynix Shows CXL Pooled Memory and MARS Rack Demos at OCP 2026
At OCP Global Summit 2026, SK hynix showed second-gen CMM-DDR5, MARS rack demos and CMM-Ax. Bandwidth and efficiency gains are the company’s comparisons.
SemiAnalysis Says ASML Is Building a Hybrid Bonding Tool, Pointing to Patent Filings
SemiAnalysis says patents point to an ASML die-to-wafer hybrid bonder on a track. ASML has not announced one; the forecasts are SemiAnalysis's own.
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