vertical integration - Page 24

AMD unveils Helion, an open OCP-based rack blueprint for agentic AI with up to 32,768 EPYC CPU cores. AMD says it is planned for November 2026.

Microsoft unveils Maia 300 and says Maia will scale to multi-gigawatt deployments from 2027 as its main inference system. Maia 200 is in production.

Lumentum, Astera Labs and Corning will demo PCIe carried over light inside an AI rack at OCP Summit. It is a proof of concept, not a shipping product.

SK chairman Chey Tae-won says Korea must build chip fabs faster as Micron and China's CXMT expand. It is commentary; no new investment was announced.

Korea Customs preliminary data: chip exports for 1 to 10 October reached $12.198bn, up 170.9%, helped by two extra working days this year.

Contractor Willy Sun pleaded guilty to four counts in the Nvidia-server China case, Reuters and Bloomberg report. Co-defendants are presumed innocent.

Samsung reportedly plans a $4.09B memory-chip testing plant in Vietnam, per Korea Herald. Testing, not wafers; Samsung has not confirmed.

A paper by Zeiss and ASML engineers sets out a 0.75 NA Hyper NA EUV tool that reuses today's light source. Reuters says it is about a decade away.

Leakers say Nvidia has stopped allocating GB202 chips to the GeForce RTX 5090. Nvidia has not confirmed it. What is claimed, what is known and what is not.

Four chip-supply items from 8–9 October 2026: GlobalFoundries tops out a €1.1 billion Dresden expansion and plans an "FDX Fusion" platform that still needs German approval; Lumentum's CEO tells Bloomberg its optical parts are "completely sold out" through early 2029, even after a 12-fold capacity increase in Japan; Unisem proposes a RM396 million packaging expansion in Malaysia; and AI chip-design start-up Phinity raises a $5.2 million seed. What is confirmed and what is a claim.