CONFIRMED as a company announcement: based on Vertiv’s press release of 12 October 2026. “India’s first” is Vertiv’s own claim and has not been independently checked. No contract value or customer name was given.
Vertiv, which makes power and cooling equipment for data centres, says it “has successfully delivered India’s first direct-to-chip high-density liquid cooling (HDLC) deployment” with CapitaLand India Trust (CLINT) at the CLDC Mumbai 01 data centre in Airoli, Navi Mumbai [1].
According to Vertiv, the project uses its secondary fluid network (SFN) system “to support 30 MW of AI workloads for a hyperscale end customer” [1]. A hyperscale customer is one of the very large cloud or AI companies; Vertiv does not say which one.
What is direct-to-chip liquid cooling?
Computer chips turn electricity into heat, and AI chips produce a lot of it in a small space. Most data centres cool their servers by blowing cold air through them. At high power densities, air struggles to carry the heat away fast enough.
Direct-to-chip liquid cooling pipes a liquid coolant to metal plates sitting right on top of the hottest chips. The liquid absorbs the heat and carries it away, in a sealed loop, to equipment that cools it down again. Liquid moves heat far better than air, so more powerful chips can be packed closer together.
Vertiv describes its SFN as a “closed loop” system that “carries coolant from a facility’s cooling infrastructure to the chip level” [1]. The “technology loop” is the part of that circuit closest to the computer equipment, and “skids” are pre-built frames holding the pumps, pipes and controls.
What Vertiv says it did
According to the release [1]:
- Built a factory for the parts. Vertiv “built a production facility capable of mass-manufacturing the customized technology loop skids designed to support future large-scale deployments.” It says the facility was designed to protect sensitive cooling parts from contamination.
- Kept dust out. Vertiv worked with CapitaLand Investment, the owner and operator of CLDC Mumbai, on installation and commissioning procedures “designed to minimize dust ingress into the technology loop.” Dirt in these narrow cooling channels can block flow and damage equipment.
- Tested before switching on. After commissioning, Vertiv balanced the loop and “carried out comprehensive Level 4 (L4) testing at the data centre to validate performance ahead of go-live.” Level 4 testing generally means testing the full system under realistic working conditions, rather than individual parts.
What Vertiv says
“The CapitaLand Investment project, particularly the collaboration, helped us accelerate the development of our manufacturing and engineering capabilities, enabling us to support the growing demands of AI-ready digital infrastructure,” said Vertiv India Managing Director Subhasis Majumdar. “As the Indian market advances toward high-density liquid cooling for hyperscale and data center applications, we see meaningful growth potential and are well positioned to deliver the scale, expertise, and innovation required for these deployments” [1].
A note on “India’s first”
The release’s headline and opening call this “India’s first” such deployment. Its closing paragraph more cautiously calls it “one of India’s first HDLC facilities” [1]. TSN has not been able to verify either version.
What is not known
- The name of the hyperscale customer.
- The contract value.
- When the capacity went, or will go, live.
Sources
- Vertiv, “Vertiv Delivers India’s First High-Density Liquid Cooling Data Center Deployment for CapitaLand India Trust, Enabling 30 MW of AI-Ready Capacity”, press release via WebNewswire, 12 October 2026. https://www.webnewswire.com/2026/10/12/vertiv-delivers-indias-first-high-density-liquid-cooling-data-center-deployment-for-capitaland-india-trust-enabling-30-mw-of-ai-ready-capacity/ (also published by CXOToday and TimesTech)
