Samsung - Page 11
Stories from Samsung come first, newest first, then stories from connected topics (SK Hynix, HBM, Semiconductors, memory chips, DRAM, AI Chips & Compute), each labelled with where it comes from. This view is not indexed by search engines.
Latest
PC Shipments Fell 20.1% Last Quarter, IDC Says, as Memory-Driven Price Rises Bite
IDC's preliminary data show worldwide PC shipments fell 20.1% year on year in Q3 2026 to 62.7 million units, and 9.1% from Q2. IDC blames supply constraints and stockpiling "ahead of memory-driven price hikes", links higher prices to the AI data-centre build-out, and says "Prices will remain elevated." What the figures show, and what they don't.
Chip Supply Roundup: A Bigger Dresden, Sold-Out Optics and Two Smaller Moves
Four chip-supply items from 8–9 October 2026: GlobalFoundries tops out a €1.1 billion Dresden expansion and plans an "FDX Fusion" platform that still needs German approval; Lumentum's CEO tells Bloomberg its optical parts are "completely sold out" through early 2029, even after a 12-fold capacity increase in Japan; Unisem proposes a RM396 million packaging expansion in Malaysia; and AI chip-design start-up Phinity raises a $5.2 million seed. What is confirmed and what is a claim.
Apple Reportedly Trims iPhone 18 Pro Parts Orders, and a $99 Ring for AI Agents
Two device stories from 8–9 October 2026. Nikkei Asia reports that Apple told some suppliers to cut production of iPhone 18 Pro components after price rises dampened demand; Apple has not commented. And start-up Natura has shown Interface, a $99 smart ring for sending voice requests to AI agents, which cannot be ordered yet.
Custom HBM Explained: Nvidia’s NVHBM Moves Memory Logic Off the Chip
Custom high-bandwidth memory puts a customer-designed base die under the memory stack, so the AI chip spends less of its own silicon talking to memory. What NVIDIA claims for its NVHBM, what SemiAnalysis estimates, and what is still unproven.
AI Chip Supply: GlobalFoundries Will Make a Key Packaging Part for TSMC in New York
GlobalFoundries has signed a multi-year $2 billion agreement to make silicon interposers for TSMC's CoWoS advanced packaging at its New York plant, with volume production expected to ramp in the first half of 2028. TSMC also reported September revenue of about NT$511.86 billion. What an interposer is and what the numbers say.
Quantum Hardware Check: DARPA’s Final Test Stage, Universal Quantum’s $100m Round and New Error-Correction Results
DARPA has moved Atom Computing, Diraq, IBM and IonQ into the final, hands-on stage of its Quantum Benchmarking Initiative, and says it increasingly expects a useful quantum computer by 2033. UK trapped-ion firm Universal Quantum has raised more than $100m, IonQ claims big speed-ups for error-corrected operations in simulations, and a peer-reviewed Cornell paper shows a full gate set on a qubit that partly tolerates its main error. Plus a Jülich preprint and Infineon's ion-trap chips. What each confirms, and what is only claimed.
China’s AI Stack Goes Vertical: How DeepSeek V4 Just Changed the Game
China's AI Stack Goes Vertical: How DeepSeek V4 Just Changed the GameA year ago, a Chinese startup called DeepSeek dropped a bomb on Silicon Valley. Its AI...
Intel Joins Elon Musk Terafab The 20 Billion Bet to Build the Worlds Largest AI Chip Factory
Intel has spent the better part of a decade falling behind. The company that once dominated semiconductor manufacturing missed the mobile revolution, fumbled advanced process nodes, and...
Foxconn’s $66.6 Billion Quarter Proves AI Infrastructure Is the Real Money
Foxconn's $66.6 Billion Quarter Proves AI Infrastructure Is the Real Money
The world's largest contract manufacturer just posted 29.7% revenue growth — and it's not from iPhones.While Silicon...
The Semiconductor Revolution: 2026s Game-Changers in Chips and AI
From geopolitical supply chain battles to Arm's AI data center CPU, 2026 is redefining the semiconductor landscape. What does this mean for the future of technology?
Latest on TSN
Explore the TSN Atlas: Every topic we cover, mapped. Click a bubble to dive in.
