HomeTech NewsNetworking & FibreCelestica Introduces DS6005, a 102.4Tbps AI Switch With Co-Packaged Optics

Celestica Introduces DS6005, a 102.4Tbps AI Switch With Co-Packaged Optics

CONFIRMED by Celestica’s press release and product page of 12 October 2026. Power, latency and reliability gains are what the switch is “designed to” deliver, per Celestica; no figures, price or ship date were given.

Celestica has introduced the DS6005, a data centre switch for AI networks that puts the optics in the same package as the switch chip [1][2].

What it is

Most network switches use pluggable optical modules in the front panel to turn electrical signals into light. In the DS6005, Celestica co-packages the optical engines with the switch chip, which it says removes the need for those front-panel modules [1]. This is called co-packaged optics (CPO).

Key specifications

  • Capacity: up to 102.4Tbps, built on the Broadcom Tomahawk 6 – Davisson switch chip [1]
  • Ports: 64 x 1.6TbE [1][2]
  • Size: 1.5OU, for OCP ORv3 racks [1]
  • Cooling: fully liquid-cooled [1]
  • Lasers: field-replaceable external laser modules [1]
  • Software: SONiC support [1]. SONiC is open-source network software.

Celestica says the design is meant to help operators improve bandwidth density, reduce latency and improve power efficiency [1]. It did not publish power or latency figures, a price or a ship date. Celestica is showing the DS6005 at the OCP Global Summit, 12-15 October 2026 [1].

Analyst view

“AI networking is shifting the constraint from compute to the physical infrastructure around it, where power, density, reach, and deployment complexity increasingly matter. Co-packaged optics is one of the industry’s important paths to address these challenges, while pluggable, near-package, and co-packaged approaches will continue to coexist as the ecosystem matures. Celestica’s DS6005 is a meaningful example of how the industry is beginning to apply CPO to high-density AI networking, giving operators another option as they scale AI fabrics,” said Sameh Boujelbene, Vice President of Research at Dell’Oro Group [1].

Sources

  1. Celestica, “Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics”, GlobeNewswire via Financial Post, 12 October 2026. https://financialpost.com/globe-newswire/celestica-introduces-the-ds6005-data-center-switch-with-co-packaged-optics-to-enable-power-efficient-ai-fabrics
  2. Celestica, DS6005 product page. https://cls.celestica.com/hardware-platforms/ds6005/

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