AI Chip Supply: GlobalFoundries Will Make a Key Packaging Part for TSMC in New York
GlobalFoundries has signed a multi-year $2 billion agreement to make silicon interposers for TSMC's CoWoS advanced packaging at its New York plant, with volume production expected to ramp in the first half of 2028. TSMC also reported September revenue of about NT$511.86 billion. What an interposer is and what the numbers say.
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